Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties

Department of Business and Entrepreneurial Management, Kainan University, No. 1, Kainan Road, Luchu, Taoyuan 33857, Taiwan, ROC Department of Mechanical Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan, ROC Department of Mechanical Engineering and Graduate Institute of Industrial Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan, ROC